Printed wiring board and method for manufacturing same

ABSTRACT

A method for manufacturing a printed wiring board, including providing a support board having a metal foil secured to the support board, forming a resin insulation layer on the metal foil, forming openings in the resin insulation layer, forming a conductive circuit on the resin insulation layer, forming in the openings via conductors to electrically connect the conductive circuit and the metal foil, separating the support board and the metal foil, and forming from the metal foil external terminals to electrically connect to another substrate or electronic component.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of and claims the benefit of priorityfrom U.S. application Ser. No. 12/188,795, filed Aug. 8, 2008, whichclaims the benefit of priority to U.S. Application Nos. 60/973,971,filed Sep. 20, 2007, and 60/988,887, filed Nov. 19, 2007. The contentsof those applications are incorporated herein by reference in theirentirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a printed wiring board, morespecifically, to a printed wiring board structured with alternatelylaminated conductive circuits and insulation layers and having pads onone surface to load electronic components such as an IC.

2. Discussion of the Background

In recent years, as electronic devices become more highly functional,they are also made smaller and thinner. Accordingly, electroniccomponents such as IC chips and LSIs are becoming highly integrated at arapid pace.

In a printed wiring board manufactured by the method described inJapanese Laid-Open Patent Application 2006-19591, an electrolytic platedlayer is formed on a metal foil by electrolytic plating, and theelectrolytic plated layer is used as an etching resist to form aconductive circuit by etching. Then, the conductive circuit is used aspads for mounting a semiconductor element.

A printed wiring board manufactured by the method according to JapaneseLaid-Open Patent Application H10-41610 has a substrate made of glassepoxy or the like, which causes the printed wiring board to thicken.

The contents of those publications are incorporated herein by referencein their entirety.

SUMMARY OF THE INVENTION

According to one aspect of the present invention, a printed wiring boardincludes multiple conductive layers having conductive circuits, multipleresin insulation layers having openings and including the uppermostresin insulation layer positioned as the outermost layer of the resininsulation layers, multiple via conductors formed in the openings,respectively, and connecting the conductive circuits in the conductivelayers, and multiple component-loading pads formed of a copper foil andpositioned to load an electronic component. The resin insulation layersand the conductive layers are alternately laminated, and thecomponent-loading pads are formed on the uppermost resin insulationlayer.

According to another aspect of the present invention, a method formanufacturing a printed wiring board includes securing a metal foil to asupport board by gluing or bonding, forming a resin insulation layer onthe metal foil, forming openings in the resin insulation layer, forminga conductive circuit on the resin insulation layer, forming in theopenings via conductors to electrically connect the conductive circuitand the metal foil, separating the support board and the metal foil, andforming from the metal foil external terminals to electrically connectto another substrate or electronic component.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the invention and many of the attendantadvantages thereof will be readily obtained as the same becomes betterunderstood by reference to the following detailed description whenconsidered in connection with the accompanying drawings, wherein:

FIG. 1A is a cross-sectional view of a printed wiring board according toan embodiment of the present invention;

FIG. 1B is a plan view of a printed wiring board according to anembodiment of the present invention;

FIGS. 2A through 2C are views illustrating steps (step 1 through step 3)for manufacturing a printed wiring board according to an embodiment ofthe present invention;

FIG. 2D is a plan view of FIG. 2C;

FIGS. 3A through 3C are views illustrating steps (step 4 through step 5)for manufacturing a printed wiring board according to the foregoingembodiment of the present invention;

FIGS. 4A through 4B are views illustrating steps (step 6 through step 7)for manufacturing a printed wiring board according to the foregoingembodiment of the present invention;

FIGS. 5A through 5B are views illustrating steps (step 8 through step 9)for manufacturing a printed wiring board according to the foregoingembodiment of the present invention;

FIGS. 6A through 6B are views illustrating steps (step 10 through step11) for manufacturing a printed wiring board according to the foregoingembodiment of the present invention;

FIGS. 7A through 7B are views illustrating steps (step 12 through step13) for manufacturing a printed wiring board according to the foregoingembodiment of the present invention;

FIGS. 8A through 8C are views illustrating step (step 14 through step16) for manufacturing a printed wiring board according to the foregoingembodiment of the present invention;

FIG. 9 is a schematic view (view 1) illustrating pads arranged on theoutermost layer of a printed wiring board according to an embodiment ofthe present invention and wiring between the pads;

FIG. 10 is a schematic view (view 2) illustrating a pad-forming regionarranged on the outermost layer of a printed wiring board according toan embodiment of the present invention, pads formed in the pad-formingregion, and wiring between the pads; and

FIG. 11 is a cross-sectional view illustrating a printed wiring boardand pads manufactured by a conventional method.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The embodiments will now be described with reference to the accompanyingdrawings, wherein like reference numerals designate corresponding oridentical elements throughout the various drawings.

As shown in FIG. 1A, printed wiring board 100 according to an embodimentof the present invention has laminate (18L) having resin insulationlayers (10L_(j): j=1˜N) and conductive layers (19L_(j)) with aconductive circuit (conductive pattern) laminated alternately, and viaconductors for interlayer connections to connect the conductive circuitsformed in separate conductive layers (including via conductors(14L_(1,1)˜14L_(N,M)) corresponding to later-described first pads(15L_(k): k=1˜M)); first pads (first external connection terminals)(15L_(k)) formed on the surface positioned in the (+Z) direction (thefirst surface of the uppermost resin insulation layer (10L₁)); and (c)solder members (solder bumps) (30L_(k)) formed on the above pads(15L_(k)). Also, printed wiring board 100 has (d) solder resist (20L)formed on the surface in the (−Z) direction (the second surface of thelowermost resin insulation layer) of laminate (18L).

In printed wiring board 100, first pads (15L_(k)) on which soldermembers (30L_(k)) are formed are arranged, as shown in FIG. 1B,two-dimensionally on the first surface of the uppermost resin insulationlayer (10L₁) to form a pad group.

Also, the solder resist has multiple openings. Those openings partiallyopen the surface of conductive circuit (19L_(N)) formed on the secondsurface of the lowermost resin insulation layer, or the surfaces of viaconductors. The openings formed in the solder resist may also partiallyopen the surfaces of via conductors and portions of the conductivecircuit (via lands) connected to the via conductors. Portions of theconductive circuit (the lowermost conductive circuit) or portions of viaconductors exposed through the openings become the second pads (thesecond external connection terminals). Here, the first surface of eachresin insulation layer indicates the surface where the first pads areformed; and the second surface of each resin insulation layer indicatesthe opposite surface, where the second pads are formed.

Laminate (18L) is formed on support member (SM) as shown in FIG. 2A byan additive method or a subtractive method. On the outermost layer,solder resist (20L or 20U) is formed (see FIG. 6(B)), then, at apredetermined position the laminate is cut to be removed from supportmember (SM).

Through the removal process, the outermost resin insulation layeropposite where solder resist (20U or 20L) is formed becomes uppermostresin insulation layer (10U₁ or 10L₁). From the metal foil formed on thefirst surface of the uppermost resin insulation layer (the surfacefacing support member (SM), the surface of a printed wiring board to beexposed to the outside), component-loading pads (first externalconnection terminals) (15L₁˜15L_(M)) are formed (see FIGS. 1A and 1B).

The component-loading pads are preferred to be truncated and in the X-Zcross-sectional view, as shown in FIG. 1A, the area of the bottomsurface which is in contact with uppermost resin insulation layer (10L₁)is larger than the area of the upper surface where an electroniccomponent will be mounted.

A protective film is formed by an electroless plated film or the like onthe component-loading pads after the pads are formed. Accordingly,peripheral portions (94A₁ and 94B₁) of the protective film will notprotrude beyond the first pad (see FIG. 12).

The solder members are formed on the truncated-shaped pads to cover thetop and side surfaces of the first pads (see FIG. 2A).

Next, manufacturing an electronic component having the above structureis described with reference to the material of each element. First,support member (SM) is prepared (see FIG. 2A). Support member (SM) isstructured by laminating conductive layers (FU, FL) on both surfaces ofinsulation material (S). Conductive layers (FU, FL) to structure thesupport member (SM) are a metal foil with a thickness of approximately afew μm to a few tens of μm. As such, on surfaces of the support member(support board), metal layers are preferred to be formed. From the pointof forming a uniform thickness, the metal layers are more preferablymade of metal foil.

As for the above support member (SM), material such as conductive layerswith the above thickness secured by glue or the like on the surfaces ofinsulation material (S) may be used.

As for the above insulation material (S), for example, a glass laminateimpregnated with bismaleimide-triazine resin, glass laminate impregnatedwith polyphenylen ether resin, or glass laminate impregnated withpolyimide resin may be used. On both surfaces of such material, metalfoil such as copper foil may be secured by a known method.

Also, a commercially available double-sided copper-clad laminate orsingle-sided copper-clad laminate may be used. As for such acommercially available laminate, for example, “MCL-E679 FGR” (made byHitachi Chemical Co., Ltd., located in Shinjuku, Tokyo) may be listed.For example, the support member may be a glass epoxy laminate having athickness of 0.4 mm and laminated with a copper foil having a thicknessof 5 μm on two sides. In addition, as for support member (SM), a metalplate may also be used.

Then, as shown in FIG. 2B, the first surface of metal foil (11U or 11L)is laminated on conductive layer (FU or FL) so as to face eitherconductive layer (FU or FL). As for the metal foil, for example, copperfoil, nickel foil or titanium foil may be used. The second surface ofsuch metal foil, opposite the first surface, is preferred to be a mattedsurface. For example, when using copper foil for a metal foil (11U or11L), it is preferred to use thickness of approximately 3 μm toapproximately 35 μm.

Next, as shown in FIGS. 2C and 2D, conductive layer (FU or FL) and theabove metal foil are preferred to be secured to each other by gluing orbonding at the peripheral portions of support member (SM) (the portionsindicated as “AD”). In the present embodiment, the portions of theconductive layer and the metal foil to be secured are preferablyapproximately 10 to approximately 30 mm inside from the edges of themetal foil toward the center portion. More preferably, the portions areapproximately 20 mm inside from the edges. Also, it is preferred thatboth are secured approximately 1 to approximately 5 mm wide, and morepreferably approximately 2 mm wide.

The conductive layer (support board) and metal foil may be secured, forexample, by using ultrasound or an adhesive agent. Securing byultrasound is superior in regard to adhesive strength and convenience.When securing by ultrasound, using ultrasound bonding equipment forexample, securing at the required portions, which are positioned fromthe edges of support member (SM) as described above, with the requiredwidth and configurations may be conducted. As long as the conductivelayer and metal foil are removed without trouble at the later-describedremoval step, securing in a rectangular shape (see FIG. 2D) or a grid(not shown in the drawing) may be employed.

If the conductive layer and the metal foil are secured, when forming alater-described interlayer resin insulation layer or conductive layer,the following trouble may be prevented from occurring. When forming aresin insulation layer, since heating and cooling-off are repeated, theresin insulation layer repeatedly expands and shrinks. Since the resininsulation layer is formed on a metal foil, the metal foil repeatsexpansion and shrinkage following the resin insulation layer. As aresult, distortion or warping may easily occur in the metal foil. Also,substantial distortion or warping may cause snapping or bending, andthus the metal foil may break. On the other hand, by securing theconductive layer and metal foil, such trouble may be prevented fromoccurring.

Also, when forming a conductive layer by a plating process, theoccurrence of the following trouble may be prevented as well. Whenperforming plating, a substrate is required to be immersed in a solutionsuch as a plating solution. In such a case, unless the conductive layerand the metal foil are secured, the plating solution seeps between them,which may cause peeling between them. On the other hand, by securing theconductive layer and the metal foil, such a problem may be preventedfrom occurring.

Next, as shown in FIGS. 3A and 3B, to overlap bonded portions (AD),etching resists (12U, 12L) are formed. FIG. 3B is a plan view of thelaminate after etching resist (12U) is formed. Etching resist (12U) isformed to partially overlap ultrasonic welding portions (AD). To formsuch a resist, a commercially available dry film resist or liquid resistmay be used.

Then, peripheral portions of conductive layers (FU, FL) and metal foils(11 U, 11L), which are positioned at the edges of the support member,are removed respectively by etching or the like using a known method.After that, according to a standard method, the etching resist isremoved (see FIG. 3C).

Each second surface of two metal foils (11U, 11L) is preferred to bemade matted, not smooth, and if required, it may be roughened. If thesecond surface of the metal foil is smooth, it is preferred to beroughened to enhance adhesiveness with the later-described resininsulation layer. For such a roughening treatment, a black oxidetreatment using an alkaline solution or etching using a proper etchingsolution may be conducted. As for the etching solution, the microetching solution “CZ series” (made by Mec Co., Ltd., located inAmagasaki, Hyogo) or the like may be used. Accordingly, mother material(BS) is formed (see FIG. 3C).

Next, to form a resin insulation layer on each second surface (mattedsurface) of metal foils (11U, 11L) laminated on mother material (BS),the first surface of resin insulation layer (10U₁, 10L₁) is laminated(see FIG. 4A). As for the resin insulation layer, a film or prepreg forinterlayer insulation or other half-cured resin sheets may be used.Instead of using such a half-cured resin sheet, a resin insulation layermay be formed by screen-printing an uncured liquid resin on the metalfoil. Either way, through thermosetting, an interlayer resin insulationlayer (uppermost resin insulation layer 10L₁ or 10U₁) is formed (seeFIG. 4A).

As for a film for such interlayer resin insulation, for example, aninterlayer film for build-up wiring boards, “ABF series” (made byAjinomoto Fine-Techno Co., Inc., located in Kawasaki, Kanagawa), may belisted. As for prepreg, varieties of products made by Hitachi ChemicalCo., Ltd. may be used.

The thickness of the resin insulation layer is preferred to be made inthe range of approximately 30 μm to approximately 100 μm. All the resininsulation layers are preferred to be formed with resin and fillingmaterial (excluding glass cloth and long glass fiber). Especially, ifprinted wiring board 100 contains five or more resin insulation layers,all the resin insulation layers preferably contain filling material(excluding glass cloth and long glass fiber). As for the fillingmaterial, inorganic filler is preferred, and if a glass fabric is used,it is preferred to be made of short fiber.

If printed wiring board 100 contains four or fewer resin insulationlayers, among all the resin insulation layers, one or two are preferablyresin insulation layers containing core material, such as glass cloth orlong glass fiber, and resin; and the rest of the resin insulation layersare preferably resin insulation layers containing filling material,excluding glass cloth and long glass fiber, and resin.

Next, as shown in FIG. 4A, in resin insulation layers (10U₁, 10L₁),openings for via holes are formed by a laser. As for a laser to be usedfor forming openings, a carbon dioxide gas laser, excimer laser, YAGlaser or UV laser may be listed. When forming openings by a laser, aprotective film such as a PET (polyethylene terephthalate) film may beused.

Next, to enhance adhesiveness with a conductive layer, the surface of aresin insulation layer is preferred to be roughened. Roughening thesurface of a resin insulation layer is conducted, for example, byimmersing it in a potassium permanganate solution. Next, catalyticnuclei are formed on the surface of the resin insulation layer.

Then, as shown in FIG. 4B, by electroless plating using a commerciallyavailable plating bath, thin electroless plated films (PU₁, PL₁) with athickness of approximately a few μm are formed. As for the electrolessplated films formed here, electroless copper-plated films are preferred.

Next, as shown in FIG. 5A, on the electroless plated films, platingresist patterns (RU₁, RL₁) are formed. Plating resist patterns (RU₁,RL₁), formed in the areas excluding the later-described via-conductorforming region and conductive-circuit forming region, may be formed, forexample, by laminating a dry film for plating resist, exposing it tolight and then developing it.

Next, electrolytic plating is performed to form electrolytic platedfilms with a thickness of approximately 5 to approximately 20 μm in thearea where the plating resists are not formed. Accordingly, conductivecircuits and via conductors are formed. The via conductors to be formedhere are preferred to be so-called filled vias, namely vias filled inthe openings formed in the resin insulation layers. Also, the topsurfaces of the via conductors are preferably positioned on the samelevel with the top surfaces of the conductive pattern formed on the sameresin insulation layer.

Next, the plating resists are removed. Then, as shown in FIG. 5B, theelectroless plated films exposed by the removal of the above resistpatterns are removed to form conductive circuits (19U, 19L) and viaconductors (14U, 14L). Here, to remove the electroless plated films,since the electroless plated films are thin, etching without usingetching resist (hereinafter, may be referred to as “quick etching”) maybe conducted.

Such quick etching is conducted, for example, by using a hydrogenperoxide/sulfuric acid type etching solution.

Through the above steps, the first-layer resin insulation layer (theuppermost resin insulation layer), the first-layer conductive layer andvia conductors are formed (see FIG. 5B). Here, the first-layerconductive circuit is formed on the second surface of the uppermostresin insulation layer. The surfaces of the conductive pattern(conductive circuit) and via conductors are preferred to be roughened.

Next, to form the second-layer resin insulation layer, the first surfaceof the above-described half-cured resin sheet is laminated on the secondsurface of the uppermost resin insulation layer and on the firstconductive layer. Then, by repeating the steps shown from FIG. 4A toFIG. 5B, the second-layer resin insulation layer and second-layerconductive layer and via conductors are formed. Likewise, the steps fromforming a resin insulation layer to forming via conductors and aconductive pattern are repeated to obtain laminates (17U, 17L) where arequired number of resin insulation layers and conductive layers arealternately laminated (see FIG. 6A).

In the following, on the outermost resin insulation layers (10U_(N),10L_(N)) (the lowermost resin insulation layers) of each laminate (17U,17L) and on conductive circuits (19U_(N), 19U_(N)) and via conductors(14U_(N, M/2+1), 14U_(N, M/2), 14L_(N, M/2+1), 14L_(N, M/2)) formed onthe second surface of the lowermost resin insulation layers, solderresists (20L, 20U) are formed. Here, the surfaces of the lowermost resininsulation layers and the surfaces of the conductive circuits formed onthe second surfaces of the lowermost resin insulation layers are allpreferred to be roughened.

Here, roughening the surfaces of resin insulation layers and rougheningthe surfaces of the conductive circuits are preferably conductedseparately. For example, to roughen the surfaces of the above resininsulation layers, the laminates formed in the above are immersed in apotassium permanganate solution. Also, to roughen the above conductivecircuits, the above-described “CZ series” micro etching solution may beused.

Next, by exposing to light and developing the solder resist, openings toexpose the surfaces of conductive circuits (19U_(N), 19U_(N)) and viaconductors (14U_(N, M/2+1), 14U_(N, M/2), 14L_(N, M/2+1), 14L_(N, M/2))are bored (see FIG. 6A). The surfaces of the conductive circuits and viaconductors exposed through the openings in solder resists become thesecond pads (second external connection terminals). Then, on the secondexternal connection terminals (second pads), solder members (solderbumps) or pins are formed, through which electrical connection is madeto other substrates.

Here, openings formed in the solder resists may be formed so as toexpose the surfaces of via conductors and portions of the conductivecircuits (via lands) connected to the via conductors. In such a case,portions of the conductors exposed through the openings in the solderresist will structure the second pads.

Next, laminate (17U), which is structured with metal foil (11U),multiple resin insulation layers (10U₁˜10U_(N)), multiple conductivelayers (19U₁˜19U_(N)), (14U_(1,1)˜14U_(N, M/2+1)),(14U_(1, 2)˜14U_(N, M/2)) and solder resist (20U), and laminate (17L),which is structured with metal foil (11L), multiple resin insulationlayers (10L₁˜10L_(N)), multiple conductive layers (19L₁˜19L_(N)),(14L_(1, 1)˜14L_(N, M/2+1)), (14L_(1, 2)˜14L_(N, M/2)) and solder resist(20L), are cut along cutting lines (A1, A2) arranged inside the portions(AD) bonded by ultrasound (see FIG. 6B), so as to remove them fromsupport member (SM) respectively. By doing so, the above two laminatesare removed from support member (SM).

As a result, intermediate substrate (18L) shown in FIG. 7A andintermediate substrate (18U) shown in FIG. 7B are obtained. As such,intermediate substrates (18U, 18L) formed simultaneously on bothsurfaces of support member (SM) may be obtained simultaneously.

In the following, steps to form printed wiring board 100 fromintermediate substrate (16L) are described. On intermediate substrate(16L) removed from support member (SM), the surface opposite wheresolder resist (20L) is formed (the first surface of the uppermost resininsulation layer) is covered by metal foil (11L) (see FIG. 7A).

On metal foil (11L), a dry film resist for etching is laminated, and,using a proper mask, is exposed to light and developed. Accordingly,resist patterns (PRL₁˜PRL_(N)) are formed (see FIG. 8A).

Next, as shown in FIG. 8B, using an etching solution (an etchant)containing copper (II) chloride or iron (II) chloride, portions of themetal foil, which exclude the area where the resist pattern is formed,are removed to form first pads (15L_(k), k=1˜M) on the first surface ofthe uppermost resin insulation layer. By forming component-loading pads(first pads) from the metal foil, uniform thickness of each pad may beeasily achieved. Also, since the first pads are formed using the resistas an etching mask, unlike conventional methods, the electrolyticplating layer may be prevented from protruding beyond the pad at its topsurface.

Here, to protect the second external connection terminals from theetchant, the surface of the solder resist and the openings are preferredto be covered by the above-described resist.

On the surfaces of first pads (15L_(k)) (including the side surfaces ofthe first pads) formed above, a protective film formed with one or morelayers of electroless plated films is formed. When forming a one-layerprotective film, for example, electroless Au-plated film or electrolessPd-plated film is formed on the pads. When forming a two-layerprotective film, for example, electroless nickel-plated film and thenelectroless gold-plated film are formed on the pads in that order. Whenforming a three-layer protective film, between the above electrolessnickel-plated film and electroless gold-plated film, an electrolessPd-plated film is formed.

Before forming a protective film on the first pads, the resist on thesolder resist is removed and a protective film is formed on the secondexternal connection terminals.

On the surfaces of first pads (first external connection terminals)(15L_(k)) and the second pads (second external connection terminals),instead of a protective film made of electroless plated film, awater-soluble OSP film (Organic Solderability Preservative) may beformed. By forming a protective film or an OSP film, corrosionprevention and solderability may be enhanced.

When an OSP film is formed on a pad, since the OSP film is a very thinsingle-molecular film, the thickness of a component-loading padstructured with a component-loading pad (first pad) and the protectivefilm practically equals the thickness of the above component-loadingpad. Furthermore, after the component-loading pads are formed, aprotective film is formed on their surfaces, and thus, the protectivefilm formed on the top surfaces of the pads is prevented from protrudingbeyond the pads.

Next, on first pads (15L_(k)), for example, solder paste is printed byscreen-printing. Since the above component-loading pads (first pads) areshaped truncated as described above, a protective film is formed on allsurfaces of the pads (top surfaces and side walls). Therefore, soldermembers (solder bumps) get wet and spread over the top surfaces and sidewalls of the first pads. Then, via the solder bumps formed on the firstpads, for example, an electronic component such as an IC chip ismounted.

Next, as shown in FIG. 8C, by conducting a reflow process, solder bumps(30L_(k)) are formed to mount an IC chip or the like.

On the second pads, solder bumps are formed in the same manner as aboveto connect to, for example, another substrate such as a mother board.Accordingly, a printed wiring board according to an embodiment of thepresent invention is manufactured. In the above-described printed wiringboard according to an embodiment of the present invention, on theuppermost resin insulation layer and the first pads, solder resisthaving openings to expose the first pads may be formed.

Also, the first pads may be arranged on the uppermost resin insulationlayer (10L₁) as shown in FIG. 9, and then connected with each other byinner conductive circuit (44L_(n+1)). When forming the first pads assuch, PAL shown in FIG. 10 becomes a pad-forming region (pad-formingregion for component-loading pads). Those pads formed as above may beused as, for example, 30L_(n) for signals, 32L_(n+1) for ground and31L_(n+1) for power supply. Here, the pad-forming region forcomponent-loading pads is a region which is shaped rectangular (includesboth square and rectangle) or circular (includes both circle andellipse) with a minimum area to include all the pads.

As shown in FIG. 9, component-loading pads include power-supplycomponent-loading pads and ground component-loading pads. In thepad-forming region for component-loading pads, it is preferred that atleast either inner conductive circuit for power supply (41L_(n)) toelectrically connect power-supply component-loading pads, or innerconductive circuit for ground (41L_(n+1)) to electrically connect groundcomponent-loading pads be formed.

FIG. 10 is a view of the uppermost resin insulation layer seen fromabove. As shown in the illustration, in the printed wiring boardaccording to an embodiment of the present invention, on the uppermostresin insulation layer a conductive circuit to be drawn from the pads ispreferred not to be extended toward the periphery of the substrate. Itis preferred that the component-loading pads arranged on the uppermostresin insulation layer be formed in the pad-forming region; and that inthe region excluding the pad-forming region, the surface of theuppermost resin insulation layer be exposed.

The above-described printed wiring board according to an embodiment ofthe present invention does not have a core substrate such as aconventional example does. Generally, without a core substrate, therigidity of a printed wiring board may be lowered, or the thermalexpansion coefficient may become large. As a result, on the solder bumpsconnecting an electronic component and the printed wiring board, largestress may be exerted, causing problems with connection reliability.

However, in the above-described printed wiring board according to anembodiment of the present invention, since solder bumps are formed onthe top surfaces and side walls of the first pads, the bonding strengthbetween the solder members and the component-loading pads is enhanced.Accordingly, the solder members are seldom removed from thecomponent-loading pads. Thus, without a core substrate, connectionreliability with an IC chip would not be disrupted. At least the sidesurfaces of the first pads (component-loading pads) are preferred to beroughened, because the adhesive strength between the pads and the solderbumps is further enhanced.

Also, when a pad has a rectangular cross-section, if a solder bump isformed even on the side surfaces of the pad, the distance between solderbumps becomes shorter. However, the cross-section of thecomponent-loading pad (seen in the direction perpendicular to thesurface of the uppermost resin insulation layer) is truncated as shownin FIG. 8B. Thus, if a solder bump is formed on the side walls of thefirst pad, the distance between adjacent solder bumps may remain large.

Also, the surface of the uppermost resin insulation layer is roughenedas described above. Thus, the wettability of the underfill improves andthe filling performance of the underfill is enhanced. Accordingly, theadhesive strength between the underfill and the uppermost resininsulation layer may be enhanced.

EXAMPLES

In the following, examples of the present invention are described indetail. However, the present invention is not limited to those examples.

Example 1 Manufacturing a Printed Wiring Board (1) Manufacturing MotherMaterial (BS)

As for support member (SM), double-sided copper-clad laminate (SM)(product number: MCL-E679 FGR, made by Hitachi Chemical Co., Ltd.),where 18 μm-thick copper foils (FU, FL) are laminated on both surfacesof 0.4 mm-thick glass epoxy board, was used (see FIG. 2A).

Next, as shown in FIG. 2A, on both surfaces of double-sided copper-cladlaminate (SM), the first surfaces of 18 μm-thick copper foils (11U, 11L)were laminated. One surface of copper foils (11U, 11L) was matted(roughened surface), and the second surface was designated as a mattedsurface (roughened surface). Next, a horn of ultrasound bondingequipment was set so as to bond the copper foil and the double-sidedcopper-clad laminate at the positions 20 mm inside from each edge. Then,under the following conditions, the horn was moved along the four sidesto bond the copper-clad laminate and the copper foil (see FIGS. 2C and2D).

horn amplitude: approximately 12 μm

number of oscillations of horn: f=28 kHz/sec.

pressure of horn exerted on copper foil: p=approximately 0-12 kgf

feed rate of horn along copper foil: v=approximately 10 mm/sec.

FIGS. 2B and 2C show the secured portions of the double-sidedcopper-clad laminate and the metal foil. The secured portions arelocated 20 mm inside from each edge of the metal foil toward the center,and the width of the secured portions is 2 mm.

Next, on the metal foil, using a commercially available product, etchingresists were formed, then exposed to light and developed. Then, as shownin FIGS. 3A and 3B, the etching resists were patterned to overlap thebonded portions (AD).

Next, through a tenting process using an etching solution containingcopper (II) chloride or others, portions of copper foils (FU, 11U) and(FL, 11L) where etching resists were not formed were removed. Then,according to a standard method, the etching resists were removed andmother material (BS) was manufactured.

(2) Forming a Laminate Through a Build-Up Process

On both surfaces (the second surface of the metal foil) of mothermaterial (BS) manufactured as above, an interlaminar film for build-upwiring (“ABF series,” made by Ajinomoto Fine-Techno Co., Inc.) waslaminated and thermoset at about 170° C. for 180 minutes. Accordingly,resin insulation layers (the uppermost resin insulation layers) (10U,10L) were formed. Then, as shown in FIG. 4A, openings for via holes wereformed using a carbon dioxide gas laser.

Next, the surfaces of the resin insulation layers were roughened byusing a 50 g/L potassium permanganate solution at 50-80° C. for 1-5minutes. Then, electroless copper plating was performed using acommercially available plating bath to form electroless copper-platedfilms (chemical copper-plated films) with a thickness in the range ofapproximately 0.3-1 μm as shown in FIG. 4B.

Next, a commercially available dry film was laminated. After that, asshown in FIG. 5A, plating resists were patterned by a photographicmethod.

Electrolytic copper plating was performed using the electrolesscopper-plated films formed on the resin insulation layers as electrodesto form 5-20 μm-thick electrolytic copper-plated films on theelectroless copper-plated films where the plating resists were notformed. Then, the plating resists were removed.

Next, as shown in FIG. 5B, the electroless copper-plated films locatedbetween the electrolytic copper-plated films were removed to formconductive circuits and via conductors. Here, the via conductors wereformed so as to fill the openings formed in the resin insulation layersand to make their top surfaces flush with the top surfaces of theconductive patterns formed on the same resin insulation layers.

The above steps were repeated eight times to form laminates (17U, 17L)having eight (8) resin insulation layers and eight (8) conductive layers(see FIG. 6A).

(3) Forming the Second External Connection Terminals (Second Pads)

In laminates (17U, 17L) structured with eight layers, the surfaces ofthe lowermost resin insulation layers (10U_(N), 10L_(N)) (the resininsulation layers formed opposite the support board) and the surfaces ofthe conductive patterns formed on the resin insulation layers wereroughened. To roughen the surfaces of the resin insulation layers, thelaminates formed here were immersed in a potassium permanganatesolution. Also, to roughen the conductive circuits, the above-described“CZ series” was used.

Next, on the lowermost interlayer resin insulation layers and theconductive circuits formed on the lowermost interlayer resin insulationlayers, solder resists (20U, 20L) were formed using a commerciallyavailable product. Then, masks were laminated on the solder resists, andopenings were formed by a photolithographic method in solder resists(20U, 20L). The surfaces of the via conductors and the surfaces of theconductive patterns exposed through the openings were made into thesecond external connection terminals (see FIG. 6A).

(4) Removing from Support Member (SM) and Forming the First ExternalConnection Terminals (First Pads)

The cutting sections were set so as to position just inside the bondedportions (see A1 and A2 in FIG. 6B), and cutting was conducted at thosesections. Then, laminates (17U, 17L) were removed from support member(SM) to make intermediate substrates (18U, 18L) respectively.

On copper foil (11L) of laminate (18L) which was removed from supportmember (SM) and exposed, a commercially available dry film for etchingresist was laminated. Then, the etching resist was patterned by aphotographic method (see FIG. 8A).

To protect the second pads formed in solder resist (20L) from theetchant, an etching resist the same as above was laminated to cover theentire surface of solder resist (20L) and the openings.

Next, using an etching solution containing mainly copper (II) chlorideand under a spraying pressure of 0.3-0.8 MPa, etching was conducted toremove the portions of the copper foil where the etching resist was notformed. The first pads were formed accordingly. The configuration offirst pads 15L_(k) (k=1˜M) was made truncated, as shown in FIG. 8B,where the area of the bottom surface which was in contact with the firstsurface of uppermost resin interlayer insulation layer (10L₁) was largerthan the area of the top surface on which to mount an electroniccomponent.

Also, as described above, the uppermost insulation layer was formed onthe roughened surface of the copper foil. Therefore, after the copperfoil was removed by etching, on the first surface of the uppermost resininsulation layer, a roughened surface copied from the roughened surfaceof the copper foil was formed.

Next, as shown in FIG. 8B, the etching resist was removed to form agroup of pads containing multiple component-loading pads (first pads).Since component-loading pads (first pads) were formed from metal foil(11L), the thickness of each pad was made substantially uniform. Also,since the first pads were formed using the resist as an etching mask, atthe top surface of a pad an electrolytic-plated layer protruding beyondthe pad was not formed.

(5) Processing the Surfaces of the Pads

After the first pads were formed, the surfaces of each first pad andsecond pad were processed by an OSP (Organic Solderability Preservative)to form a protective film. By doing so, a very thin single-molecularfilm was formed on the pads, and the thickness of a component-mountingpad structured with the component-loading pad (first pad) and theprotective film was practically equal to the thickness of the pad. Also,after the first pads were formed, a protective film was formed on theirsurfaces, and thus the protective film formed on the top surface of apad was prevented from protruding beyond the pad.

(6) Forming Solder Bumps

Next, as shown in FIG. 8C, by a screen printing method, solder paste wasprinted on the first pads and second pads and processed by a reflow toform solder bumps on the above first and second pads (solder bumps onthe second pads were omitted in FIG. 8C). Since a protective film wasformed on the entire surface of the first pads (top surfaces and sidewalls), the solder bumps get wet and spread over the top surfaces andside walls to be formed.

Although the embodiment of the present invention does not have a coresubstrate, since solder bumps were formed on the top surfaces and sidewalls, the bonding strength between the solder bumps and the first padswas enhanced. Accordingly, the solder bumps were seldom removed from thefirst pads. Also, since the cross-sectional configuration of the firstpads was truncated, the distance between adjacent solder bumps issubstantially the same as the distance between the pads, thus remaininglarge.

Also, in Example 1, on the uppermost resin insulation layer and on thefirst pads, a solder resist having openings to expose the first pads wasnot formed. Therefore, in contrast with a printed wiring board which hasa solder resist, the distance between the surface of the uppermost resininsulation layer and an IC chip was large. As a result, underfillperformance to seal between the IC chip and the printed wiring board wasimproved.

Also, since the surface of the uppermost resin insulation layer wasroughened as described above, the wettability of the underfill wasimproved and the filling performance of the underfill was enhanced.Accordingly, adhesive strength between the underfill and the uppermostresin insulation layer improved.

Example 2

For support member (SM), a double-sided copper-clad laminate, where 5μm-thick copper foil (FU, FL) is laminated on both surfaces of 0.4mm-thick fiber-reinforced plastics, was used as substrate (SM). Oncopper foil (FU, FL), a copper foil was secured by an epoxy-typeadhesive agent. The rest was the same as in Example 1 to form a printedwiring board.

Example 3

In Example 1, on both first and second pads, an OSP film was formed as aprotective film. In contrast, in this example, on the surfaces of bothfirst and second pads, an electroless nickel-plated film and anelectroless gold-plated film were formed in this order as a protectivefilm. On the top surfaces and side walls, this protective film wasformed.

The rest was the same as in Example 1 to form a printed wiring board. Inthis example, to achieve a uniform thickness of the protective filmformed on each first pad, a protective film was formed not byelectrolytic plating, but by electroless plating. Also, electroniccomponent-mounting pads were structured with electroniccomponent-loading pads and a protective film formed with an electrolessplated film. As a result, the distance between electrodes of anelectronic component and electronic component-mounting pads becameuniform.

Example 4

Copper foils (11U, 11L) used in Example 1 to form the first pads werechanged. In this example, a copper foil whose first surface was smoothand whose second surface was matted was used. Also, the side surfaces ofthe first pads were roughened after the first pads were formed butbefore the etching resist was removed. The rest was the same as inExample 1 to form a printed wiring board. As a result, the first pads inExample 4 had smooth top surfaces and roughened side walls.

Example 5

A protective film formed in Example 1 was formed neither on the firstpads nor on the second pads. Since the first pads were formed only witha copper foil, the thickness of each first pad was uniform. As a result,uniform distance between each electrode of an electronic component suchas an IC and each first pad, as well as a reduced amount of solder foruse to form solder bumps, was achieved. Accordingly, a reduction in theconnection resistance between the printed wiring board and theelectronic component was realized.

Example 6

In Example 5, to enhance the bonding strength between solder bumps andfirst pads, a CZ treatment was conducted to roughen the surfaces of thefirst pads. Accordingly, the top surfaces and side walls of the firstpads became roughened.

Example 7

In Example 6, on both first and second pads, a protective film formedwith an electroless gold-plated film was formed.

Example 8

In Example 6, on both first and second pads, a protective film wasformed using an OSP.

Example 9

In Example 9, a method for manufacturing a printed wiring boardaccording to another embodiment shows how to bond support board (SM) andcopper foil (11U, 11L) using techniques other than ultrasonic bonding.

According to Example 1, metal foils (11U, 11L) on the support board (SM)are bonded by using ultrasound. However, a method for bonding both metalfoils (11U, 11L) is not limited to such. As long as both metal foils areadhered firmly from the first step to the step for separating both metalfoils (see FIGS. 2A through 7B), other bonding methods may be used. Forexample, a method for firmly adhering with an adhesive agent, or amethod for firmly adhering by solder may be used. When bonding thesupport board (SM) and metal foil (11U, 11L) with an adhesive agent, thesupport board (SM) may be either an insulation plate, metal plate, or asupport board having a metal foil on its surface.

In Example 9, FRP (fiber reinforced plastics) is used as a support board(SM). A copper foil is laminated on the FRP, and then using an adhesiveagent, the peripheral portion of the copper foil and the support boardis secured. Then, following the process shown in FIG. 3C and thesubsequent processes of Example 1, a printed wiring board is produced.

If an adhesive agent is used when bonding the support board and themetal foil, any agent satisfying the following requirements may be used:When processing in each step with reference to FIGS. 2C through 7B, thesupport board and the metal foil will not peel; when an insulation layerformed on the metal foil hardens or shrinks, the metal foil will notdeform or break due to warping, snapping, bending, or distorting; and ineach step with reference to FIGS. 2C through 7B, a processing solutionor the like will not be contaminated.

Considering the above, resins that will not soften or melt at aprocessing temperature during each step in FIGS. 2C through 7B areselected.

When the support board and the metal foil are entirely bonded, anadhesive agent to be used is preferred to meet the followingrequirements: At temperatures lower than a range that may degrade aprinted wiring board, a printed wiring board (metal foil 11U, 11L) andthe support board (SM) may be separated; namely, thermoplastic resins,which do not soften or melt at a processing temperature in each stepshown in FIGS. 2C through 6B (for example, 180° C.), but soften or meltat a temperature lower than a range that may degrade a printed wiringboard, or at the temperature of or lower than a soldering temperature(for example, 280° C.), will be selected.

Alternately, instead of the ultrasonic bonding in Example 1, the supportboard (SM) and the metal foil (11U, 11L) may be bonded by solder.However, when applying solder, to avoid thermal damage on the printedwiring board area, it is preferred that solder be applied not on theentire area, but on limited areas.

According to embodiments of the present invention, by bonding thesupport board and the copper foil, from the first step to the step forseparating printed wiring boards, the adhesiveness between the supportboard and the copper foil may be preserved. Accordingly, even ifinsulation layers harden/shrink, deformation (for example, crooking,warping, snapping, bending, etc.) or breakage of copper foil (11U, 11L)is prevented. As a result, a printed wiring board having excellentconnection reliability between pads formed from the copper foil andvia-conductors is produced. Also, a printed wiring board where padsformed from the copper foil seldom rupture and align accurately isproduced.

As described above, a printed wiring board according to the presentinvention is useful as a thin-type printed wiring board. It is suitableto use for manufacturing smaller devices.

Furthermore, a printed wiring board according to the present inventionis suitable to manufacture with a high yield a thin-type printed wiringboard having excellent connection reliability.

A printed wiring board according to an embodiment of the presentinvention has: multiple resin insulation layers each having openings forvia conductors; multiple conductive layers each having a conductivecircuit; via conductors formed in the openings and connecting conductivecircuits formed in separate conductive layers among the conductivelayers; and component-loading pads to mount an electronic componentformed on the uppermost resin insulation layer positioned as theoutermost layer among the multiple resin insulation layers. The resininsulation layers and conductive layers are laminated alternately andthe component-loading pads are formed from a metal foil.

Here, the bottom surface of the component-loading pads, which is incontact with the surface of the uppermost resin insulation layer, ispreferred to be shaped truncated, and its area is larger than the areaof the upper surface for mounting an electronic component. Furthermore,on the component-loading pads' upper surfaces where an electroniccomponent is mounted, and on the side surface of the component-loadingpads, solder members are preferred to be formed. Also, the side surfacesof the component-loading pads are preferred to be roughened.

In addition, in the printed wiring board, on the uppermost resininsulation layer, it is preferred that a conductive circuit drawn fromthe pads not be extended toward the periphery of the substrate.Furthermore, it is preferred that the component-loading pads arranged onthe uppermost resin insulation layer be formed in a pad-forming region,and that in the region excluding the pad-forming region the surface ofthe uppermost resin insulation layer be exposed.

Moreover, on the upper surface and side surfaces of thecomponent-loading pads, a protective film is preferred to be formed, andthe interlayer resin insulation layers are preferred to be insulationlayers containing filling material (excluding glass cloth and long glassfiber).

In the printed wiring board, the component-loading pads includepower-supply component-loading pads and ground component-loading pads.In the component-loading pad forming region, at least either an innerconductive circuit for power supply which electrically connectspower-supply component-loading pads, or an inner conductive circuit forground which electrically connects ground component-loading pads ispreferred to be formed.

According to another embodiment of the present invention, a method ofmanufacturing a printed wiring board includes: by gluing or bonding,securing a metal foil to a support board; forming a resin insulationlayer on the metal foil; forming openings for via conductors in theresin insulation layer; forming a conductive circuit on the resininsulation layer; forming via conductors in the openings to electricallyconnect the conductive circuit and the metal foil; separating thesupport board and the metal foil; and from the metal foil, formingexternal terminals for electrical connection with other substrates orelectronic components.

Here, the metal foil is preferably secured by gluing or bonding itsperipheral portions to the support board. In the method of manufacturinga printed wiring board, it is preferred to further include: forming anupper-layer resin insulation layer so as to cover the resin insulationlayer and the conductive circuit; forming openings for upper-layer viaconductors in the upper-layer resin insulation layer; forming anupper-layer conductive circuit on the upper-layer resin insulationlayer; and forming upper-layer via conductors to electrically connectthe conductive circuit and the upper-layer conductive circuit.

On the surface of the support board, it is preferred that a metal layerbe formed and that the metal layer be a metal foil. Then, the supportboard and the metal foil are preferably secured by ultrasonic bonding.Also, the support board is preferred to be a metal plate.

By structuring as above, the height of each first pad becomessubstantially uniform. As a result, the distance between those pads andthe electrodes of an electronic component may be made substantiallyequal. Accordingly, stresses may be prevented from being exerted oncertain bumps, and thus connection reliability may be enhanced.

Also, since the distance between each electrode of an electroniccomponent and each first pad corresponding to each electrode of theelectronic component is made equal, the amount of solder to connect themmay be reduced. Accordingly, the connection resistance between theelectronic component and the printed wiring board may be lowered, thusmalfunctions of the electronic component may be prevented. Furthermore,since the amount of solder is reduced, when mounting the component(reflowing), the amount of heat exerted on the printed wiring board maybe reduced.

Obviously, numerous modifications and variations of the presentinvention are possible in light of the above teachings. It is thereforeto be understood that within the scope of the appended claims, theinvention may be practiced otherwise than as specifically describedherein.

1. A method for manufacturing a printed wiring board, comprising:providing a support board having a metal foil secured to the supportboard; forming a resin insulation layer on the metal foil; formingopenings in the resin insulation layer; forming a conductive circuit onthe resin insulation layer; forming in the openings via conductors toelectrically connect the conductive circuit and the metal foil;separating the support board and the metal foil; and forming from themetal foil external terminals to electrically connect to anothersubstrate or electronic component.
 2. The method for manufacturing aprinted wiring board according to claim 1, wherein the providing of thesupport board comprising gluing or bonding peripheral portions of themetal foil to the support board.
 3. The method for manufacturing aprinted wiring board according to claim 1, further comprising: formingan upper-layer resin insulation layer to cover the resin insulationlayer and conductive circuit; forming openings in the upper-layer resininsulation layer; forming an upper-layer conductive circuit on theupper-layer resin insulation layer; and forming upper-layer viaconductors in the openings formed in the upper-layer resin insulationlayer to electrically connect the conductive circuit and the upper-layerconductive circuit.
 4. The method for manufacturing a printed wiringboard according to claim 1, wherein the support board comprises at leastone metal surface.
 5. The method for manufacturing a printed wiringboard according to claim 4, wherein the metal surface of the supportboard comprises a metal foil.
 6. The method for manufacturing a printedwiring board according to claim 1, wherein the providing comprisessecuring the metal foil to the support board by ultrasound bonding. 7.The method for manufacturing a printed wiring board according to claim1, wherein the support board comprises a metal plate.
 8. The method formanufacturing a printed wiring board according to claim 1, wherein theforming of the conductive circuit and the forming of the via conductorsare carried out simultaneously.
 9. The method for manufacturing aprinted wiring board according to claim 3, wherein the forming of theupper-layer conductive circuit and the forming of the via conductors arecarried out simultaneously.
 10. The method for manufacturing a printedwiring board according to claim 1, wherein the support board comprises acopper clad laminate.
 11. The method for manufacturing a printed wiringboard according to claim 10, wherein the providing of the support boardcomprises securing the metal foil to the copper clad laminate byultrasound bonding.